Modeling and characterization of the bondingwire interconnection article pdf available in ieee transactions on microwave theory and techniques 491. The bond pad requirement also changes with the selection bond wire size. Modeling and characterization of the bondingwire interconnection. Kulicke and soffa model 4526 wire bonder users manual. The equivalence of a bond wire is the lumped inductance in series with the resistance. Bond wire radius specificic resistance rho specific conductance kappa 1e6 ohmm 1e6 s m silver 0,016 62 copper 0,018 56 gold 0,022 44 aluminium 0,028 36. Gold, au, aluminum, al, bonding wire and ribbon for use in microelectronics and rfmicrowave assembly, offered on half inch, 12 and two inch, 2 spools.
Harman sited cause as manufacturing defects or environmental stresses. Bonding models atoms or ions in minerals are glued together by electrical bonds that are ionic, covalent, or metallic. The formula for bond wire inductance looks similar to that of airbridge inductance. Adams developed a model for wire failure near ball bond. This video shows how ads is used to verify a mmic kuband lna inserted in a 3mil x 3mil qfn package including bond wires using the integrated 3d em simulator, emds. Model 4526 autostepback wedge bonder the model 4526 autostepback wedge bonder is used with aluminum wire, gold wire and ribbon. Im interesting in how wire bonds parameters can be modeled for microwave integrated circuit.
The newest line is the ibond5000 series and is based on the 4500 series which was a market leader for over a decade. Levels of automation vary from completely manual to fully automatic. Package design and ic design, two traditionally isolated processes, should now become seamlessly integrated in an automated design flow. Jun 06, 20 bond wire modeling guidelines4, 5 bonding methods. The types and intensities of these bonds in a mineral determine its physical and chemical properties, including hardness, cleavage, and conductivity ionic bonds ionic bonding model. The 4526 offers control of individual bond parameters and programmable. The problem is i dont know how to approach the mmic pad, just use a 50ohm microstrip line to stand for it. I have already ask the ansoft engineering about the the bond wire simulation. Set material type for each layerlevel in the stack up i. The wire bonding machine will operate by automatically running.
Although less common, wire bonding can be used to connect an ic to other electronics or to connect from one printed circuit board pcb to another. Bonds are made by the wedgewedge technique using ultrasonic. This model uses programmable software thus insuring that all bonds on the high power semiconductor devices are identical. The hfss tool was used to investigate the effects of the ferrite epoxy glob core on inductance and q factor.
It was also found that odd number of bond wires along with reduced gap height results in better rf performance. After setting the parameter and used the dummy to set the capillary and gold wire, the operator will load the part, which already passed mounting process at the loader stack. This model implies that the number of bond wires is less than or equal to 512. The information contained in this document is subject to change without notice. When possible, wire should retain the recommended convex upward profile.
Furthermore, hfss modeling was used to optimize bondwire inductor. The ansoft stuff suggests to use the lumped port to connect the bond wire directly,no mmic pad, but the results seem to be wrong. Im interesting in how wire bond s parameters can be modeled for microwave integrated circuit. The height of the end point over the ground h3 may be set equal to zero, allowing bond wire to touch ground. The materials properties are rarely measured at high frequencies so the user must measure it themselves. Hfss is a highperformance fullwave electromagnetic em. Using hfss successfully at 77ghz data sheets give you the dielectric constant and the loss tangent or do they. Lets take this just a step further, and use an equation for wire inductance. Ndc international represents the mpp micro point pro ltd line of manual wire bonders in the usa, mexico and canada. I have use the wizard and also i use a lumped port. Multiple bond wires are also employed in some applications for reliability criteria but in case of rf it is linked with the reduction of inductance and resistance. Edition discs price new from used from dvd, ntsc october 24, 2016 please retry 1. In this model, the tool moves by a digitally controlled motorized z, while the work alignment is controlled by the operator with a choice of alignment by. High reliability copper alloy bonding wire provides wider second bond process window and lower resistivity than bare copper.
Alloy shape model o diameter length code description 3 gold au 15 code description 0 round wire gold wire au 0 gsa 18 m mil 12. Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip. The machine bonds aluminum or gold wires ranging from 0. Fusing currents the current carrying capability of a bond wire changes with size of the wire and material used for it. Bond wire plays an important role in device performance since at higher frequencies inductance and resistance associated with it causes degraded performances. Package and bondwire effects in ads with emds youtube. Softer fab and higher bond reliability after aging 2000 hours. Figure 7 wire bond to alsicu metallization using the old bonding schedule. Hfss solver on demand for package and pcb characterization. It is especially appropriate for your high quality applications requiring tight control of wire length and loop formation. This information will be used to create the 3d model in the ansys hfss environment. Lifted metallization from substrate pad photos of copper wire failures 3 4 1 2 5 limited reliability data is available for copper wire in plastic encapsulated. Using hfss successfully at 77ghz data sheets give you the dielectric constant and the loss tangent. Dec 03, 2016 hello guys, i have one link where you find hfss v as well as hfss v15 its details with steps involved for download and install on your pc, laptops.
Bond wires 11 hfss models of bondwires real bondwires. Also, the associated inductance and resistance value of the bond wire varies with frequency. Here is a reference with some numerical info to select bond wire size, material and bond pad. In highspeed ic design, bondwires introduce parasitics such as inductance and magnetic coupling which may affect product performance significantly.
The principle they use is thermosonic bonding, which involves heat, high frequency vibration, and pressure. One thing that stands out to me is the ability of the machine to form the wires as well as attach them. Design of experiments approach for improving wire bonding quality. Wire bonding is the method of making interconnections between an integrated circuit ic or other semiconductor device and its packaging during semiconductor device fabrication.
Bond wire and its characterization at rf frequencies. Wire bond article about wire bond by the free dictionary. Download limit exceeded you have exceeded your daily download allowance. Jan, 2017 the bond itself isnt just a simple solder. A good rule of thumb is that for onemil wire bonds 25 micron diameter, length in millimeters is nearly equal to inductance in nanohenries. One might question the model discussed above, especially as concerns the stickiness between bond tool and wire surface at all times, and one might argue that at least during the final or tempering phase the bond tool glides across the wire surface rather than working the wire bulk. Then he needs to load the dummy into the loader and try to bond the dummy part. Ic designers now need the ability to draw, model and optimize bondwires as parts of their circuits. Since the image wire carries a current opposite to the current flow in the bond wire, the effective inductance of the bond wire becomes 11. Pdf modeling and characterization of the bondingwire.
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